State-of-the-Art Equipment

We operate a wide range of equipment and are continually investing to stay at the forefront of Manufacturing Technology.

SIPLACE Placement Technology Siplace X High Speed Platform: maximizing productivity, flexibility, accuracy and reliability.

 

  • Siplace X3 (x2)
  • Siplace X4 (x2)

Siplace S Platform Proven capability for medium speed applications, with maximum modularity.

  • Siplace S23 (x1)
  • Siplace S27 HM (x1)

Siplace F Platform Combining fine-pitch placement head, with collect and place revolver heads.

  • Siplace F5 (x1)
state of the art equipment

Mydata – Prototype Department

My Platform Flexibility & accuracy, ideal for prototype assembly.

  • MY 12 (x1)

Printing Technology

AP Platform: A range of fully automatic in-line stencil printers with 2D vision. Building on from the original AP, through to the advanced high speed Excel.

  • MPM AP 25 HIE (x2)
  • MPM AP Excel (x1)

Marking

ASYS

10 W CO2 laser system for marking barcodes and other unique identity marks directly onto PCBs

  • ALS 03 Automatic Laser Marking System

Stencil/Board Cleaning

  • DCT Injet 388 mCRD

Dispensing Equipment

  • Camelot Gemini II (x1)
  • Fuji GLV (x1)

Reflow Ovens

Asscon

  • Quicky 450: Vapour-Phase soldering machine providing the ability to solder high quality assemblies defect-free

Rehm

V series: A developing range of force convection ovens to support high speed reflow and curing applications

  • Rehm SMS-V6-N2 (x1) Nitrogen enabled & Lead-free capable
  • Rehm SMS-V7 (x2) Lead-free capable

Wave Solder

Automatic mass wave solder solutions with integral spray flux systems operating with Nitrogen

  • Soltec Delta (x2)

Automatic Component Insertion (ACI)

  • Universal Axial 6241B
  • Universal Radial 6348A
  • Universal DIP6772

Analysis Laboratory Capabilities

  • X-Ray Nordson Dage XD7500VR
  • Banner Scientific Grinding Station
  • Banner Scientific Polishing Station
  • Buehler Cast N’ Vac 1000 Vacuum Impregnation System
  • Dremel Bench saw
  • Multicore Solderability Tester
  • Cemco Solderability Tester
  • Bausch & Lomb Microscope (1000x)
  • Sony Technolook
  • Ersascope
  • Climatic Test Chamber
  • Nikon Profile Projector (Shadowgraph)
  • Hunter Z-Check
  • Nikon Measurescope Travelling Microscope
  • Minolta Datacolor Photospectrometer
  • Wayne Kerr Precision Inductance Analyzer 3245
  • AC/DC Insulation Breakdown Tester
  • HP High Resistance Meter

Inspection / Rework

  • Ersa IR650 Semi-Automatic Rework Centre – Suitable for removal/replacement of a wide range of devices. Maximum device size 60x120mm, maximum PCB size 560x460mm.
  • Cyberoptic SE 300 In line 3D solder paste inspection system (x2)
  • Ersascope System 3000
  • Vision Engineering – visual inspection
  • JBC – manual re-work stations
  • Metcal – manual re-work station
  • Weller – manual re-work station
  • Zevac – semi-automatic rework station
  • PDR – semi-automatic rework station
  • SRS – semi-automatic rework station
  • Purex – extraction equipment
  • BOFA – extraction equipment
  • MMM – PCB baking oven
  • Zevac – liquid solder pot rework station
state of the art equipment

Test Equipment

Flying Probe

  • APT 9400 – a fast, easy to use and dependable fixtureless tester. Reduces program development times from days to hours. Suitable for small production runs. Supported by in-house program development, debug and maintenance

Automated optical inspection

  • Mirtec MV2-HTL – Flexible bench top AOI system programmed from customer CAD data and established library files. Supported by in-house program development, debug and maintenance
  • DCB Automation Supervision (2) – Flexible Bench top AOI system programmed from customer CAD data and established library files. Supported by in-house program development, debug and maintenance
  • Cyberoptic Flex HR In Line AOI System (x2)

Conventional In Circuit

  • HP (AGILENT) 307X (2) – A high speed machine with enhanced capabilities including complex digital device testing, ‘TESTJET’ open circuit test and Flash programming. Supported by in-house program development, debug and maintenance
  • Teradyne 18XX (4) – A medium speed machine with capabilities covering basic Major Defects Analyzer requirements, through to powered digital and analogue tests. Supported by in-house program development, debug and maintenance
  • MARCONI M75 (1) – A high pin count dedicated backplane tester. Supported by in-house program development, debug and maintenance

JTAG test capabilities

  • XJTAG (7) – A powerful, flexible JTAG test tool. Supported by in-house program development, debug and maintenance.  We have a long and successful relationship with XJTAG as a developer of XJTAG test solutions –www.xjtag.com
  • JTAG Technologies (1) – A powerful, flexible JTAG test tool. Capable of running customer or third party provided programs

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SMS House, Technology Drive, Beeston, Nottingham NG9 1AD Tel: +44 (0)115 943 1616

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SMS Electronics & Product Services | Electronic Manufacturing Services Registered Number: 4496144,   Registered Office: SMS House, Technology Drive, Beeston, Nottingham NG9 1AD,   VAT Number: GB 804541944